La description

Key facts The combination of R&S®SMBV-K50 and R&S®SMBV-K51 offers easy, flexible configuration of real-time, fully coded (transport and physical layer) TD-SCDMA (3GPP TDD LCR) test signals for evaluating components, power amplifiers, digital base-band receiver chips and RF receivers in user equipment and base stations. The TD-SCDMA firmware package is in accordance to 3GPP TDD LCR with a chip rate of 1.28 Mcps (Low Chip rate Mode) and already contains the HSDPA functionality for TD-SCDMA.
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